Technology - production parameters
Base material
| base material | FR4, FR2, CEM1 |
| base material thickness | 0,2 mm - 3,2 mm |
| copper layer thickness | 18 um, 35 um, 70 um |
Dimensions
| maximum board dimensions | 400 mm x 600 mm |
| minimum / maximum hole diameter | 0.3mm / 6.0 mm |
| milled hole maximal dimension and shape | any |
| minimum trace width: | |
| for copper thicknes 18um | 0.2mm (8mils) |
| for copper thicknes 35um | 0.25mm (10mils) |
| for copper thicknes 70um | 0.35mm (15mils) |
| minimum clearance between traces | 0.25 mm (10 mils) |
| minimum board (or panel) size | 200x300 mm |
